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Optimization study on the uniform temperature of an additively manufactured cooler for a semiconductor heating device
参考中译:半导体加热装置外加式冷却器均匀温度的优化研究


          

刊名：Applied Thermal Engineering
作者：Seung Yeop Lee（Smart Manufacturing Technology R&D Group, Korea Institute of Industrial Technology (KITECH)）
Kun Woo Kim（Smart Manufacturing Technology R&D Group, Korea Institute of Industrial Technology (KITECH)）
Da Hye Kim（Smart Manufacturing Technology R&D Group, Korea Institute of Industrial Technology (KITECH)）
Min Seok Yang（Smart Manufacturing Technology R&D Group, Korea Institute of Industrial Technology (KITECH)）
Ji Wook Kim（Smart Manufacturing Technology R&D Group, Korea Institute of Industrial Technology (KITECH)）
Geuna Choi（School of Mechanical Engineering, Kyungpook National University）
Jae Wook Lee（Smart Manufacturing Technology R&D Group, Korea Institute of Industrial Technology (KITECH)）
Il Seouk Park（School of Mechanical Engineering, Kyungpook National University）
刊号：725C0058
ISSN：1359-4311
出版年：2023
年卷期：2023, vol.225
页码：120178-1--120178-20
总页数：20
分类号：TK12
关键词：Design optimization；Surrogate model；Cooling device；Uniform temperature distribution；Additive manufacturing；Multi-thermal load region
参考中译：设计优化；代理模型；冷却装置；均匀温度分布；附加制造；多热负荷区
语种：eng
文摘：A semiconductor heating device is the core component of the apparatus used for testing semiconductor dies. It is important to heat semiconductor dies at a uniform temperature. The surface temperature of the cooler, which is a component of the heating device, directly affects heating temperature uniformity. Thus, a uniform temperature of the cooler enables uniform heating of semiconductor dies. In this study, we developed an optimization method for achieving temperature uniformity in coolers, using an approach based on a surrogate model. The technique developed in this study simplified the conjugate heat transfer in the channel network of a cooler. A body-centered cubic lattice core was adopted for the local augmentation of heat-transfer performance within the internal channel of the cooler. To reveal the effects of the flow speed and lattice column diameter on the pressure drop and heat transfer, a computational fluid dynamics simulation was implemented using a central composite design, with the Reynolds number and diameter ratio varying in the ranges of 3078-23852 and 0.0869-0.313, respectively. The surrogate model was defined after the dimensional analysis of a single channel and circuit analogy. A particle swarm optimization algorithm was adopted to determine the optimal column diameters of each lattice structure based on the surrogate model. The optimization of the cooler of the semiconductor heating device was assessed by comparing it with a model consisting of only identical lattices in each position. The results showed a prominent enhancement, wherein the deviation in the temperature was reduced by 83.4%.
参考中译：半导体加热装置是用于测试半导体管芯的设备的核心部件。在均匀的温度下加热半导体芯片是很重要的。冷却器是加热装置的组成部分，其表面温度直接影响加热温度的均匀性。因此，冷却器的均匀温度使得半导体管芯能够均匀加热。在这项研究中，我们开发了一种实现冷却器内温度均匀的优化方法，使用了一种基于代理模型的方法。本研究开发的技术简化了冷却器通道网络中的共轭换热。采用体心立方晶格芯局部强化冷却器内通道内的换热性能。为了揭示流动速度和格子柱直径对压降和换热的影响，采用中心复合设计进行了计算流体力学模拟，雷诺数和直径比分别在3078-23852和0.0869-0.313范围内变化。通过对单通道和电路类比的量纲分析，定义了代理模型。基于代理模型，采用粒子群优化算法确定每种网格结构的最优柱径。通过与每个位置只包含相同晶格的模型的比较，评估了半导体加热装置的冷却器的优化。结果表明，改进后的温度偏差降低了83.4%。



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