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Conformally printed additively manufactured RF demonstrator for circuit compaction
参考中译:用于电路压缩的保形印刷增材制造RF演示器


          

刊名：Flexible and Printed Electronics
作者：Andrew Luce（Electrical and Computer Engineering Department, Raytheon UMass Lowell Research Institute (RURI), University of Massachusetts Lowell）
Christopher Areias（Electrical and Computer Engineering Department, Raytheon UMass Lowell Research Institute (RURI), University of Massachusetts Lowell）
Susan Trulli（Raytheon Missile and Defense Systems）
Elicia Harper（Raytheon Missile and Defense Systems）
Yiwen Zhang（Raytheon Missile and Defense Systems）
Guinevere Strack（Electrical and Computer Engineering Department, Raytheon UMass Lowell Research Institute (RURI), University of Massachusetts Lowell）
John Lovaasen（Raytheon Missile and Defense Systems）
Alkim Akyurtlu（Electrical and Computer Engineering Department, Raytheon UMass Lowell Research Institute (RURI), University of Massachusetts Lowell）
刊号：736C0032/I
出版年：2024
年卷期：2024, vol.9, no.4
页码：045007-1--045007-15
总页数：15
分类号：TN41
关键词：Additive manufacturing；Printed electronics；Non-planar circuits；Aerosol jet printing
参考中译：增材制造;印刷电子;非平面电路;气溶胶喷射印刷
语种：eng
文摘：Recently, there has been interest in applying additive manufacturing (AM) to radio frequency (RF) and microwave applications, especially in packaging of microelectronic devices. Additive packaging offers advantages of expanded functionality in restricted volume, through miniature, low-SWaP-C sensors, allowing for non-traditional form factors. In this work, design, fabrication, and characterization of a non-planar monolithic microwave integrated circuit (MMIC) is presented to demonstrate significant footprint reduction and circuit compaction. Performance of a non-planar passive RF device and details of planar to non-planar AM connections for characterization of the transitions will be demonstrated. The work will present details of the design and fabrication of the non-planar structure, optimization of the process parameters for the Optomec 5-axis Aerosol Jet Printer for multi-material printing, and the results of the characterization and testing. RF measurements were conducted to demonstrate the functionality of the developed non-planar circuit and compared with simulations which showed good agreement. The results of this work show that fully additive approach is feasible for non-planar circuits, which will allow for footprint reduction, weight reduction, and achievement of novel form factors that are critical for microwave applications.
参考中译：最近，人们对将增材制造（AM）应用于射频（RF）和微波应用，特别是在微电子设备的包装中产生了兴趣。增材包装通过微型、低SWaP-C传感器在有限的体积内提供了扩展功能的优势，允许非传统的形状因素。在这项工作中，介绍了非平面单片微波集成电路（MMIC）的设计、制造和特性，以证明显着减少占地面积和电路紧凑性。将演示非平面无源RF器件的性能以及用于描述转变的平面到非平面AM连接的详细信息。该工作将详细介绍非平面结构的设计和制造、用于多材料打印的Optomec 5轴气溶胶喷射打印机的工艺参数优化以及特性描述和测试结果。进行了RF测量以证明所开发的非平面电路的功能，并与模拟进行了比较，结果显示出良好的一致性。这项工作的结果表明，完全添加方法对于非平面电路是可行的，这将有助于减少占地面积、减轻重量并实现对微波应用至关重要的新型形状因素。



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