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2001, vol.50, no.1	2001, vol.50, no.10	2001, vol.50, no.11	2001, vol.50, no.12	2001, vol.50, no.2	2001, vol.50, no.3
2001, vol.50, no.4	2001, vol.50, no.5	2001, vol.50, no.6	2001, vol.50, no.7	2001, vol.50, no.8	2001, vol.50, no.9

题名	作者	出版年	年卷期
Semiconductor inspection systems for the new generation	Yasutsugu Usami	2001	2001, vol.50, no.5
LSI mask / wafer pattern inspection	Minoru Ito	2001	2001, vol.50, no.5
Inspection of glass substrate for flat panel display	Mutsumi Hayashi	2001	2001, vol.50, no.5
Present status of non-destructive testing for semiconductor packages	Yukio Ogura	2001	2001, vol.50, no.5
Three dimensional X-ray radioscopic technology for electronic parts	Masashi Fujii	2001	2001, vol.50, no.5
Measurement of thermal distribution for electronic devices using infrared camera	Hideyuki Uemura	2001	2001, vol.50, no.5
Quantitative estimation of flaw height by radiographic testing (Report 4)- estimation of flaw height of a slit-like flaw -	Kazuo Nakamura; Jun Suetsugu; Kazuo Hirayama; Kenji Hashimoto; Mitsuaki Katoh	2001	2001, vol.50, no.5
Damage zone location in a GFRP storage tank by lamb wave AE analysis	Yoshihiro Mizutani; Norifumi Fukawa; Takashi Futatsugi; Hideo Nishino; Mikio Takemoto	2001	2001, vol.50, no.5
Eddy current testing of weld zone using uniform eddy current probe	Kiyoshi Koyama; Hiroshi Hoshikawa; Noriyuki Taniyama	2001	2001, vol.50, no.5