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期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



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2009, vol.11, no.1 2009, vol.11, no.2 2009, vol.11, no.3 2009, vol.11, no.4

题名作者出版年年卷期
The Box-Pandora's or Schrodinger's?Dick Ross20092009, vol.11, no.4
A Growing Disconnect Between Commercial and High-Reliability ApplicationsChris Henderson20092009, vol.11, no.4
Nanoprobing SRAM Bit Cells with High-Speed PulsesRichard E. Stallcup II; Kanzan Inoue20092009, vol.11, no.4
Magnetic Current Imaging in Failure AnalysisAntonio Orozco20092009, vol.11, no.4
Raman Temperature MeasurementsR. Aaron Falk; Tram Pham20092009, vol.11, no.4
The Changing Face of Nondestructive Failure AnalysisSandra Delgado20092009, vol.11, no.4
Delivering ValueTed Lundquist20092009, vol.11, no.3
FEI Announces New Quanta 50 Series SEMRosalinda M. Ring20092009, vol.11, no.3
Buehler Offers System for Decapsulation of Microelectronic PackagesRosalinda M. Ring20092009, vol.11, no.3
Zeiss Introduces New, Highly Flexible CrossBeam WorkstationRosalinda M. Ring20092009, vol.11, no.3
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