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期刊
ISSN
0960-1317
刊名
Journal of Micromechanics and Microengineering
参考译名
微型机械与微型工程学报
收藏年代
2006~2025
全部
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2011, vol.21, no.1
2011, vol.21, no.10
2011, vol.21, no.11
2011, vol.21, no.12
2011, vol.21, no.2
2011, vol.21, no.3
2011, vol.21, no.4
2011, vol.21, no.5
2011, vol.21, no.6
2011, vol.21, no.7
2011, vol.21, no.8
2011, vol.21, no.9
题名
作者
出版年
年卷期
Fabrication of PDMS through-holes using the MIMIC method and the surface treatment by atmospheric-pressure CH_4/He RF plasma
Jongchan Choi; Kyeong-Hwan Lee; Sung Yang
2011
2011, vol.21, no.9
Hydrophobic-hydrophilic conversion in microfluidic polymer channels with TiO_2 thin films
Hyun Jik Park; In Tae Kim; Sang Hui Park; Sang Kyung Kim
2011
2011, vol.21, no.9
Porous ceramics for multistage Knudsen micropumps-modeling approach and experimental evaluation
Naveen K. Gupta; Yogesh B. Gianchandani
2011
2011, vol.21, no.9
Characterization of a micromachined parylene-based thermal C-shape actuator
Minchul Shin; Aaron P. Gerratt; Cinzia Metallo; Alex Brindle; Brian P. Kierstead; Robert D. White
2011
2011, vol.21, no.9
Microfluidic laminate-based phantom for diffusion tensor-magnetic resonance imaging
R. Samuel; H. J. Sant; F. Jiao; C. R. Johnson; B. K. Gale
2011
2011, vol.21, no.9
Effect of hydrophobic microstructured surfaces on conductive ink printing
Seunghwan Kim; Hyun Wook Kang; Kyung Heon Lee; Hyung Jin Sung
2011
2011, vol.21, no.9
Characterization of Si nanowires fabricated by Ga~+ FIB implantation and subsequent selective wet etching
R. Bottger; L. Bischoff; B. Schmidt; M. Krause
2011
2011, vol.21, no.9
Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly
Bo Chang; Iiris Routa; Veikko Sariola; Quan Zhou
2011
2011, vol.21, no.9
Reliability design and assessment of a micro-probe using the results of a tensile test of a beryllium-copper alloy thin film
Jun-Hyub Park; Myung-Soo Shin
2011
2011, vol.21, no.9
Entropy generation of droplet motion with surface tension hysteresis in a closed microchannel
A. Odukoya; G. F. Naterer; I. Dincer
2011
2011, vol.21, no.9
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