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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2013, vol.23, no.1 2013, vol.23, no.10 2013, vol.23, no.11 2013, vol.23, no.12 2013, vol.23, no.2 2013, vol.23, no.3
2013, vol.23, no.4 2013, vol.23, no.5 2013, vol.23, no.6 2013, vol.23, no.8 2013, vol.23, no.9

题名作者出版年年卷期
Self-formed cylindrical microcapillaries through surface migration of silicon and their application to single-cell analysisFan Zeng; Yuan Luo; Levent Yobas; Man Wong20132013, vol.23, no.5
Design, fabrication and application of an SOI-based resonant electric field microsensor with coplanar comb-shaped electrodesPengfei Yang; Chunrong Peng; Dongming Fang; Xiaolong Wen; Shanhong Xia20132013, vol.23, no.5
Hot-switched lifetime and damage characteristics of MEMS switch contactsR. P. Hennessy; A. Basu; G. G. Adams; N. E. McGruer20132013, vol.23, no.5
High-temperature zirconia microthruster with an integrated flow sensorVille Lekholm; Anders Persson; Kristoffer Palmer; Fredric Ericson; Greger Thornell20132013, vol.23, no.5
Wafer-level packaging and laser bonding as an approach for silicon-into-lab-on-chip integrationT. Brettschneider; C. Dorrer; M. Brundel; R. Zengerle; M. Daub20132013, vol.23, no.5
Pneumatic RF MEMS switch using a liquid metal dropletSeungbum Baek; Usung Park; In Ho Choi; Joonwon Kim20132013, vol.23, no.5
CMOS MEMS capacitive absolute pressure sensorM. Narducci; L. Yu-Chia; W. Fang; J. Tsai20132013, vol.23, no.5
Creating large out-of-plane displacement electrothermal motion stage by incorporating beams with step featuresYong-Sik Kim; Nicholas G. Dagalakis; Satyandra K. Gupta20132013, vol.23, no.5
The two-dimensional array of 2048 tilting micromirrors for astronomical spectroscopyM. D. Canonica; F. Zamkotsian; P. Lanzoni; W. Noell; N. de Rooij20132013, vol.23, no.5
Fabrication of a 3D electrically small antenna using holographic photolithographyJ. J. Toriz-Garcia; J. J. Cowling; G. L. Williams; Q. Bai; N. L. Seed; A. Tennant; R. McWilliam; A. Purvis; F. B. Soulard; P. A. Ivey20132013, vol.23, no.5
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