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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2013, vol.23, no.1 2013, vol.23, no.10 2013, vol.23, no.11 2013, vol.23, no.12 2013, vol.23, no.2 2013, vol.23, no.3
2013, vol.23, no.4 2013, vol.23, no.5 2013, vol.23, no.6 2013, vol.23, no.8 2013, vol.23, no.9

题名作者出版年年卷期
Microinjection molding of microsystem components: new aspects in improving performanceCan Yang; Xiao-Hong Yin; Guang-Ming Cheng20132013, vol.23, no.9
Measurements of residual stresses in the Parylene C film/silicon substrate using a microcantilever beamJyun-Siang Peng; Weileun Fang; Hung-Yi Lin; Chun-Hway Hsueh; Sanboh Lee20132013, vol.23, no.9
AlN micromechanical radial-contour disc resonatorGang Wang; Li-Xin Xu; Abdallah Ababneh; Patrick Schwarz; Dara Feili; Helmut Seidel20132013, vol.23, no.9
A microneedle array able to inject tens of thousands of cells simultaneouslyGregory H. Teichert; Sandra Burnett; Brian D. Jensen20132013, vol.23, no.9
Residual stresses at cavity corners in silicon-on-insulator bonded wafersT. W. Lin; O. Elkhatib; J. Makinen; M. Palokangas; H. T. Johnson; G. P. Horn20132013, vol.23, no.9
A MEMS-fluxgate-based sensing system for the detection of DynabeadsJian Lei; Chong Lei; Tao Wang; Zhen Yang; Yong Zhou20132013, vol.23, no.9
Development of a peristaltic gas micropump with a single chamber and multiple electrodesK. S. Lee; B. Kim; M. A. Shannon20132013, vol.23, no.9
A quadratic-shaped-finger comb parametric resonatorCongzhong Guo; Gary K. Fedder20132013, vol.23, no.9
A wafer-level Sn-rich Au-Sn intermediate bonding technique with high strengthZhiqiang Fang; Xu Mao; Jinling Yang; Fuhua Yang20132013, vol.23, no.9
Formation, release and assembly of a non-evaporative photocurable liquid through micromolding and inkjet printingChin-Tai Chen; Hsiang-Pi Huang20132013, vol.23, no.9
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