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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2014, vol.24, no.1 2014, vol.24, no.10 2014, vol.24, no.11 2014, vol.24, no.12 2014, vol.24, no.2 2014, vol.24, no.3
2014, vol.24, no.4 2014, vol.24, no.5 2014, vol.24, no.6 2014, vol.24, no.7 2014, vol.24, no.8 2014, vol.24, no.9

题名作者出版年年卷期
Design, fabrication and thrust measurement of a micro liquid monopropellant thrusterJeongmoo Huh; Sejin Kwon20142014, vol.24, no.10
Investigation of contact electrification based broadband energy harvesting mechanism using elastic PDMS microstructuresLokesh Dhakar; F. E. H. Tay; Chengkuo Lee20142014, vol.24, no.10
Soft ferrite cores characterization for integrated micro-inductorsYen Mai Nguyen; David Bourrier; Samuel Charlot; Zarel Valdez-Nava; Vincent Bley; Celine Combettes; Thomas Lopez; Jean-Pierre Laur; Magali Brunet20142014, vol.24, no.10
A long-term stable power supply μDMFC stack for wireless sensor node applicationsZonglin Wu; Xiaohong Wang; Xiaozhao Li; Manqi Xu; Litian Liu20142014, vol.24, no.10
Modulation of Parylene-C to silicon adhesion using HMDS primingXiao Chuan Ong; Gary K. Fedder; Peter J. Gilgunn20142014, vol.24, no.10
Characterization of a vertically movable gate field effect transistor using a silicon-on-insulator waferIn-Hyouk Song; William B. D. Forfang; Bryan Cole; Bypung Hee You20142014, vol.24, no.10
Design and implementation of a novel conical electrode for fast anodic bondingChii-Rong Yang; Jim-Wei Wu; Long-Yin Chang20142014, vol.24, no.10
Hot switching damage mechanisms in MEMS contacts - evidence and understandingAnirban Basu; Ryan P. Hennessy; George G. Adams; Nicol E. McGruer20142014, vol.24, no.10
Micro device design and fabrication for the experimental investigation of jet impingement on an array of micro pin finsSidy Ndao; Yoav Peles; Michael K. Jensen20142014, vol.24, no.10
Micromechanical devices with controllable stiffness fabricated from regular 3D porous materialsJames H. Pikul; Zhenting Dai; Xindi Yu; Huigang Zhang; Taewan Kim; Paul V. Braun; William P. King20142014, vol.24, no.10
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