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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2014, vol.24, no.1 2014, vol.24, no.10 2014, vol.24, no.11 2014, vol.24, no.12 2014, vol.24, no.2 2014, vol.24, no.3
2014, vol.24, no.4 2014, vol.24, no.5 2014, vol.24, no.6 2014, vol.24, no.7 2014, vol.24, no.8 2014, vol.24, no.9

题名作者出版年年卷期
Epitaxial patterning of thin-films: conventional lithographies and beyondWei Zhang; Kannan M. Krishnan20142014, vol.24, no.9
Low-temperature anodic bonding using thin films of lithium-niobate-phosphate glassS. Woetzel; E. Kessler; M. Diegel; V. Schultze; H. G. Meyer20142014, vol.24, no.9
Phase separation micromoulding and photopatterning based on radiation induced free radical polymerisation of acrylates for the microfabrication of porous monolithic structuresChristian Elsner; Daniel Heinz; Andrea Prager; Wolfgang Knolle; Klaus Zimmer20142014, vol.24, no.9
Development of an electrohydrodynamic ion-drag micropump using three-dimensional carbon micromesh electrodesDong Hyun Yoon; Hironobu Sato; Asahi Nakahara; Tetsushi Sekiguchi; Satoshi Konishi; Shuichi Shoji20142014, vol.24, no.9
On-chip enucleation of an oocyte by untethered microrobotsAkihiko Ichikawa; Shinya Sakuma; Masakuni Sugita; Tatsuro Shoda; Takahiro Tamakoshi; Satoshi Akagi; Fumihito Arai20142014, vol.24, no.9
Fabrication and characterization of a charge-biased CMOS-MEMS resonant gate field effect transistorC. H. Chin; C. S. Li; M. H. Li; Y. L. Wang; S. S. Li20142014, vol.24, no.9
A facile and simple high-performance polydimethylsiloxane casting based on self-polymerization dopamineXing Chen; Lu-lu Zhang; Jian-hai Sun; Hui Li; Da-fu Cui20142014, vol.24, no.9
Design, development and characterization of an x-band 5 bit DMTL phase shifter using an inline MEMS bridge and MAM capacitorsSukomal Dey; Shiban K. Koul20142014, vol.24, no.9
A gimbal-less two-axis electrostatic scanner with tilted stationary vertical combs and serially connected springs via a microassembly processMin-Ho Jun; Seunghwan Moon; Byeong Ha Lee; Jong-Hyun Lee20142014, vol.24, no.9
Self-aligned metallization on organic semiconductor through 3D dual-layer thermal nanoimprintY. Jung; X. Cheng20142014, vol.24, no.9
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