先进制造业知识服务平台
国家科技图书文献中心机械分馆　　工信部产业技术基础公共服务平台　　国家中小企业公共服务示范平台

期刊


ISSN1537-0755
刊名Electronic Device Failure Analysis
参考译名电子设备故障分析
收藏年代2004～2024



全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2014, vol.16, no.1 2014, vol.16, no.3 2014, vol.16, no.4

题名作者出版年年卷期
Contoured Device Sample Preparation for ±5 μm Remaining Silicon Thickness (RST) TolerancesChris Richardson20142014, vol.16, no.4
3-D ICs: Progress Updates, Reliability Concerns, and Failure MechanismsTimothy Lenihan; E. Jan Vardaman; Greg Caswell; Craig Hillman20142014, vol.16, no.4
Magnetic Current Imaging RevisitedDave Vallett20142014, vol.16, no.4
Failure Analysis: Why Mistakes Are Made and How to Avoid Making OneDavid Burgess20142014, vol.16, no.4
Unique FIB Application for Mechanical Cross SectioningDoug Hamilton; Phoumra Tan Xilinx20142014, vol.16, no.4
Summary of Peer-Reviewed Literature of Interest to Failure Analysis: Optics, Optical Techniques, and PhotovoltaicsMichael R. Bruce20142014, vol.16, no.4



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  京公网安备11010202008970号  机械工业信息研究院 2018-2024