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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2015, vol.25, no.1 2015, vol.25, no.10 2015, vol.25, no.11 2015, vol.25, no.12 2015, vol.25, no.2 2015, vol.25, no.3
2015, vol.25, no.4 2015, vol.25, no.5 2015, vol.25, no.6 2015, vol.25, no.7 2015, vol.25, no.8 2015, vol.25, no.9

题名作者出版年年卷期
A fabrication process for the monolithic integration of magnetoelastic actuators and silicon sensorsTang, Jun; Green, Scott R.; Gianchandani, Yogesh B.20152015, vol.25, no.4
A novel concept for long-term pre-storage and release of liquids for pressure-driven lab-on-a-chip devicesCzurratis, D.; Beyl, Y.; Zinober, S.; Laermer, F.; Zengerle, R.20152015, vol.25, no.4
Electrostatic comb-drive actuator for MEMS relays/switches with double-tilt comb fingers and tilted parallelogram beamsGao, Yongfeng; You, Zheng; Zhao, Jiahao20152015, vol.25, no.4
Effect of printing parameters on gravure patterning with conductive silver inkKim, Seunghwan; Sung, Hyung Jin20152015, vol.25, no.4
A novel bottom-up copper filling of blind silicon vias in 3D electronic packagingDu, Li; Shi, Tielin; Su, Lei; Xue, Dongmin; Liao, Guanglan20152015, vol.25, no.4
High-resolution electrohydrodynamic jet printing for the direct fabrication of 3D multilayer terahertz metamaterial of high refractive indexYudistira, Hadi Teguh; Tenggara, Ayodya Pradhipta; Oh, Sang Soon; VuDat Nguyen; Choi, Muhan; Choi, Choon-Gi; Byun, Doyoung20152015, vol.25, no.4
Formation mechanism of micro-spikes on AISI 4340 steel with femtosecond laser pulses at near-threshold fluenceKam, Dong-Hyuck; Kim, Jedo; Song, Lijun; Mazumder, Jyoti20152015, vol.25, no.4
Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placementKuran, Emine Eda; Berg, Yuval; Tichem, Marcel; Kotler, Zvi20152015, vol.25, no.4
Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)Zhang, Yazhou; Ding, Guifu; Wang, Hong; Cheng, Ping; Liu, Rui20152015, vol.25, no.4
Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresistQuintero, Andres Vasquez; Briand, Danick; de Rooij, Nico F.20152015, vol.25, no.4
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