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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2015, vol.25, no.1 2015, vol.25, no.10 2015, vol.25, no.11 2015, vol.25, no.12 2015, vol.25, no.2 2015, vol.25, no.3
2015, vol.25, no.4 2015, vol.25, no.5 2015, vol.25, no.6 2015, vol.25, no.7 2015, vol.25, no.8 2015, vol.25, no.9

题名作者出版年年卷期
Reaction injection molding and direct covalent bonding of OSTE plus polymer microfluidic devicesSandstrom, N.; Shafagh, R. Z.; Vastesson, A.; Carlborg, C. F.; van der Wijngaart, W.; Haraldsson, T.20152015, vol.25, no.7
Sub-micron gap in-plane micromechanical resonators based on low-temperature amorphous silicon thin-films on glass substratesGualdino, A.; Gaspar, J.; Chu, V.; Conde, J. P.20152015, vol.25, no.7
Experimental and numerical studies of a microfluidic device with compliant chambers for flow stabilizationIyer, V.; Raj, A.; Annabattula, R. K.; Sen, A. K.20152015, vol.25, no.7
A novel power source for high-precision, highly efficient micro w-EDMChen, Shun-Tong; Chen, Chi-Hung20152015, vol.25, no.7
On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layersSantaniello, Tommaso; Yan, Yunsong; Tocchio, Alessandro; Martello, Federico; Gassa, Federico; Webb, Patrick; Zhao, Weiwei; Tamplenizza, Margherita; Schulte, Carsten; Liu, Yang; Hutt, David; Milani, Paolo; Conway, Paul; Lenardi, Cristina20152015, vol.25, no.7
Fine droplet generation using tunable electrohydrodynamic pulsationYuan, Xin; Ba, Zhengyu; Xiong, Zhenhua20152015, vol.25, no.7
Robust thermal control for CMOS-based lab-on-chip systemsMartinez-Quijada, Jose; Ma, Tianchi; Hall, Gordon H.; Reynolds, Matt; Sloan, David; Caverhill-Godkewitsch, Saul; Glerum, D. Moira; Sameoto, Dan; Elliott, Duncan G.; Backhouse, Christopher J.20152015, vol.25, no.7
Dynamic performance analysis of a micro cantilever embedded in elastomerHosono, Minako; Matsumoto, Kiyoshi; Shimoyama, Isao; Noda, Kentaro20152015, vol.25, no.7
Solvent-free thermoplasticpoly(dimethylsiloxane) bonding mediated by UV irradiation followed by gas-phase chemical deposition of an adhesion linkerAhn, S. Y.; Lee, N. Y.20152015, vol.25, no.7
Reliable aluminum contact formation by electrostatic bondingKarpati, T.; Pap, A. E.; Radnoczi, Gy; Beke, B.; Barsony, I.; Fuerjes, P.20152015, vol.25, no.7
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