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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2016, vol.16, no.1 2016, vol.16, no.10 2016, vol.16, no.11 2016, vol.16, no.12 2016, vol.16, no.2 2016, vol.16, no.3
2016, vol.16, no.4 2016, vol.16, no.5 2016, vol.16, no.6 2016, vol.16, no.7 2016, vol.16, no.9

题名作者出版年年卷期
IPC Initiative to Standardize Machine Communications and Meet the Challenges of Industry 4.0JASON SPERA20162016, vol.16, no.4
Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE TechnologyWENNY TSAI20162016, vol.16, no.4
Advanced Soldering Technology: Crucial for Extreme Aerospace EnvironmentsKEIICHI (KEN) TAKAHASHI20162016, vol.16, no.4
Open Manufacturing Language (OML), the New Specification for Factory Machine-to-Machine CommunicationMICHAEL FORD; DAN BAILEY20162016, vol.16, no.4
APEX Lights Up Las VegasTREVOR GALBRAITH20162016, vol.16, no.4
SMT/Hybrid/Packaging 2016 Focuses on Printed ElectronicsTrevor Galbraith20162016, vol.16, no.4
Rough First Quarter in Asia; Very Modest Global Growth AheadWALT CUSTER; JOHN CUSTER-TOPAI20162016, vol.16, no.4
Per-Olof Loof: KEMET Electronics CorporationOlof Loof20162016, vol.16, no.4



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