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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2018, vol.28, no.1 2018, vol.28, no.10 2018, vol.28, no.11 2018, vol.28, no.12 2018, vol.28, no.2 2018, vol.28, no.3
2018, vol.28, no.4 2018, vol.28, no.5 2018, vol.28, no.6 2018, vol.28, no.7 2018, vol.28, no.8 2018, vol.28, no.9

题名作者出版年年卷期
A novel model for simulating the racing effect in capillary-driven underfill process in flip chipZhu, Wenhui; Wang, Kanglun; Wang, Yan20182018, vol.28, no.4
Effect of via depth on the TSV filling process for different current densitiesWang, Feng; Zhao, Zhipeng; Nie, Nantian; Wang, Fuliang; Zhu, Wenhui20182018, vol.28, no.4
Study on the mechanism of Si-glass-Si two step anodic bonding processHu, Lifang; Wang, Hao; Xue, Yongzhi; Shi, Fangrong; Chen, Shaoping20182018, vol.28, no.4
Development of a microfluidic perfusion 3D cell culture systemPark, D. H.; Jeon, H. J.; Kim, M. J.; Nguyen, X. D.; Morten, K.; Go, J. S.20182018, vol.28, no.4
Design and validation of a microfluidic device for blood-brain barrier monitoring and transport studiesOcchetta, Paola; Saccani, Alessandra; Re, Francesca; Krol, Silke; Rasponi, Marco; Redaelli, Alberto; Ugolini, Giovanni Stefano20182018, vol.28, no.4
Determination of etching parameters for pulsed XeF2 etching of silicon using chamber pressure dataSarkar, Dipta; Baboly, M. G.; Elahi, M. M.; Abbas, K.; Butner, J.; Pinon, D.; Ward, T. L.; Hieber, Tyler; Schuberth, Austin; Leseman, Z. C.20182018, vol.28, no.4
Review of microfluidic cell culture devices for the control of gaseous microenvironments in vitroLee, T-A; Ko, P-L; Chiang, H-J; Peng, C-C; Tung, Y-C; Wu, H-M20182018, vol.28, no.4
Wafer-level hermetic vacuum packaging by bonding with a copper-tin thin film sealing ringAkashi, Teruhisa; Funabashi, Hirofumi; Takagi, Hideki; Omura, Yoshiteru; Hata, Yoshiyuki20182018, vol.28, no.4
Realize multiple hermetic chamber pressures for system-on-chip process by using the capping wafer with diverse cavity depthsCheng, Shyh-Wei; Weng, Jui-Chun; Liang, Kai-Chih; Sun, Yi-Chiang; Fang, Weileun20182018, vol.28, no.4
3D-fabrication of tunable and high-density arrays of crystalline silicon nanostructuresWilbers, J. G. E.; Berenschot, J. W.; Tiggelaar, R. M.; Dogan, T.; Sugimura, K.; van der Wiel, W. G.; Gardeniers, J. G. E.; Tas, N. R.20182018, vol.28, no.4
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