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期刊


ISSN0972-7396
刊名MTT
参考译名今日制造技术
收藏年代2009～2023



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2009 2010 2011 2012 2013 2014
2015 2016 2017 2018 2019 2020
2021 2022 2023

2020, vol.19, no.1/2 2020, vol.19, no.10 2020, vol.19, no.11 2020, vol.19, no.12 2020, vol.19, no.3/4 2020, vol.19, no.5/6
2020, vol.19, no.7/8 2020, vol.19, no.9

题名作者出版年年卷期
A study of additive manufacturing in the field of MEMS manufacturingK. Hemaprasad; S. Rahul20202020, vol.19, no.9
A brief review on laser surface texturing of biomaterials for cell culture applicationsR. D. Chaileshwar; Ravi Sankar Mamilla; Sunil Magadum20202020, vol.19, no.9
Parametric optimization and analysis of pressure sensor chip membrane using design of experiments (DOE)Hemant Kumar Singh; Balaji Subramanian; N. Kusuma; S. Harsha20202020, vol.19, no.9
GSM based ATC automationSree Samanvitha M. Vadhoolas; B. K. Sushmitha; P. R. Swathi; M. Tejashwini; R. Navya; Payal Verma20202020, vol.19, no.9
Biomimicking of physiology with micro embedded systems for tree infusionSri Lakshmi Bhavani Nandamuri20202020, vol.19, no.9
Relevance of 3D x-ray imaging for electronic packages and printed circuit boardsA. Mallikarjuna Reddy; Nazrul Islam; Sarat Kumar Dash; B. S. Srinivasa; Y. R. Bhanumathy20202020, vol.19, no.9
Study of thermal behaviour in a machine tool using ansysMelvin George Ampattu; V. Shanmugaraj; G. Shruthi; J. Pradyumna20202020, vol.19, no.9
Analysis of a multi-degree-freedom PDMS composite cantilever beam for energy harvestingSanket Kulkarni; H. Shivashankar; S. M. Kulkarni20202020, vol.19, no.9
Low temperature Cu-Cu thermo-compression bonding for advanced micro-system packagingM. Prardhan Yogya; Megha Agrawal20202020, vol.19, no.9
Experimental analysis of conformality of E-beam deposited thin films for MEMS applicationsManoj Kandpal; Megha Dass; Jaspreet Singh; Satya Narayan Behera20202020, vol.19, no.9
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