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期刊


ISSN0960-1317
刊名Journal of Micromechanics and Microengineering
参考译名微型机械与微型工程学报
收藏年代2006～2025



全部

2006 2007 2008 2009 2010 2011
2012 2013 2014 2015 2016 2017
2018 2019 2020 2021 2022 2023
2024 2025

2023, vol.33, no.1 2023, vol.33, no.10 2023, vol.33, no.11 2023, vol.33, no.12 2023, vol.33, no.2 2023, vol.33, no.3
2023, vol.33, no.4 2023, vol.33, no.5 2023, vol.33, no.6 2023, vol.33, no.7 2023, vol.33, no.8 2023, vol.33, no.9

题名作者出版年年卷期
Fabrication of n-shaped micro copper structures through localized electrochemical depositionTian Qiang; Pan Chengpeng; Wang Fuliang20232023, vol.33, no.9
Experimental and numerical investigations of heat transfer and flow characteristics during flow boiling in straight and diverging PDMS microchannelAlugoju Uday Kumar; Dubey Satish Kumar; Javed Arshad20232023, vol.33, no.9
Room temperature operated flexible La-ZnO/MWCNTs sensor for ppb level carbon monoxide detectionVerma Gulshan; Pandey Vikas; Islam Monsur; Kumar Mahesh; Gupta Ankur20232023, vol.33, no.9
PEDOT:PSS stabilized paper-based piezoresistive sensor for wearable electronicsPan Xiaoying; Zhao Cong; Sun Qingyin; Qin Chu; Wu Jiaxin; Wang Min20232023, vol.33, no.9
Crosstalk-free large aperture electromagnetic 2D micromirror for LiDAR applicationGhazinouri Behrad; He Siyuan20232023, vol.33, no.9
First multiplexed electrochemical wax-on-plastic chip: PNA/GO interface integration for DNA detectionDas Prabhangshu Kumer; Adil Omair; Shamsi Mohtashim Hassan20232023, vol.33, no.9
Corrigendum: On overtravel and skate in cantilever-based probes for on-wafer measurements (2022 J. Micromech. Microeng. 32 057001)Arscott Steve20232023, vol.33, no.9
Noise analysis and modeling for a digital control architecture for Lissajous frequency-modulated MEMS gyroscope with amplitude-modulated readoutWang Xuetong; Zheng Xudong; Shen Yaojie; Xia Chenhao; Tong Wenyuan; Jin Zhonghe; Ma Zhipeng20232023, vol.33, no.9
A simple way to predict the flip–chip gapLin Chun; Gan Zhi-Kai; Huang Yue20232023, vol.33, no.9
Characterization of thin film Parylene C device curvature and the formation of helices via thermoformingThielen Brianna; Meng Ellis20232023, vol.33, no.9
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