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OA期刊


ISSN0013-5194
刊名Electronics letters
出版商Institution of Electrical Engineers
urlhppt://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=2220
机构Wiley



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2015, vol.51, no.1 2015, vol.51, no.10 2015, vol.51, no.11 2015, vol.51, no.12 2015, vol.51, no.13 2015, vol.51, no.14
2015, vol.51, no.15 2015, vol.51, no.16 2015, vol.51, no.17 2015, vol.51, no.18 2015, vol.51, no.19 2015, vol.51, no.2
2015, vol.51, no.20 2015, vol.51, no.21 2015, vol.51, no.22 2015, vol.51, no.23 2015, vol.51, no.24 2015, vol.51, no.25
2015, vol.51, no.3 2015, vol.51, no.4 2015, vol.51, no.5 2015, vol.51, no.6 2015, vol.51, no.7 2015, vol.51, no.8
2015, vol.51, no.9

题名作者出版年年卷期
Scattering analysis of SAW asymmetrical resonators and delay linesW. Soluch;20152015, vol.51, no.21
901 nm Lithographic vertical-cavity surface-emitting laser with stable single-lobed beam patternM. Li;X. Yang;Y. Zhang;G. Zhao;J. Beadsworth;L. Eifert;F. Tucker;D.G. Deppe;20152015, vol.51, no.21
Improving the power efficiency of enhanced unipolar OFDM for optical wireless communicationJian Dang;Zaichen Zhang;Liang Wu;20152015, vol.51, no.21
Experimental demonstration of plastic optical fibre-based digitised radio over fibre downlinkV.A. Thomas;D. Liu;M. El-Hajjar;L. Hanzo;20152015, vol.51, no.21
Wire crossing constrained QCA circuit design using bilayer logic decompositionA. Roohi;H. Thapliyal;R.F. DeMara;20152015, vol.51, no.21
Surface plasmon resonance sensor based on hollow-core PCFs filled with silver nanowiresYing Lu;Xianchao Yang;Mintuo Wang;Jianquan Yao;20152015, vol.51, no.21
Qubit state estimation and enhancement by quantum thermal noiseF. Chapeau-Blondeau;20152015, vol.51, no.21
Simple non-impedance-based measuring technique for supercapacitorsG. Tsirimokou;C. Psychalinos;A. Allagui;A.S. Elwakil;20152015, vol.51, no.21
Positive sequence voltage memory filter for numerical digital relaying applicationsK.M. Silva;M.L.S. Almeida;20152015, vol.51, no.21
Fluorescent light energy harvesting using a capacitive touch screenSeulkirom Kim;Katherine A. Kim;Franklin Bien;20152015, vol.51, no.21
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