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OA期刊


ISSN0013-5194
刊名Electronics letters
出版商Institution of Electrical Engineers
urlhppt://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=2220
机构Wiley



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2016, vol.52, no.1 2016, vol.52, no.10 2016, vol.52, no.11 2016, vol.52, no.12 2016, vol.52, no.13 2016, vol.52, no.14
2016, vol.52, no.15 2016, vol.52, no.16 2016, vol.52, no.17 2016, vol.52, no.18 2016, vol.52, no.19 2016, vol.52, no.2
2016, vol.52, no.20 2016, vol.52, no.21 2016, vol.52, no.22 2016, vol.52, no.23 2016, vol.52, no.24 2016, vol.52, no.25
2016, vol.52, no.3 2016, vol.52, no.4 2016, vol.52, no.5 2016, vol.52, no.6 2016, vol.52, no.7 2016, vol.52, no.8
2016, vol.52, no.9

题名作者出版年年卷期
Hysteresis versus PSM of ideal memristors, memcapacitors, and meminductorsZ. Biolek;D. Biolek;V. Biolkova;20162016, vol.52, no.20
Charge-domain switched-gm-C CBPF using semi-passive charge-sharing techniqueY. Xu;U. Moon;20162016, vol.52, no.20
Combined RF coils for brain imaging at 7 T with receive and transmit resonatorsH. Yoo;20162016, vol.52, no.20
CMOS wireless stress sensor IC with 256-cell sensing array for ultra-thin applicationsHanjun Jiang;Zheyao Wang;Shujie Yang;Heng Liu;Zhihua Wang;20162016, vol.52, no.20
Modal pattern stability factor as a figure of merit for characteristic modesE. Antonino-Daviu;N. Mohamed Mohamed-Hicho;M. Cabedo-Fabrés;M. Ferrando-Bataller;20162016, vol.52, no.20
Stacked plate capacitor design technique for filters constructed on multilayer substratesKe Cao;Chonghu Cheng;20162016, vol.52, no.20
Broadband transition between microstrip line and spoof SP waveguideJie Xu;Yinjie Cui;Jian Guo;Zhengbin Xu;Cheng Qian;Wenyuan Li;20162016, vol.52, no.20
Lagrange multiplier-based error compensation of heterodyne interferometerK. Lee;Y. Pyo;K. You;20162016, vol.52, no.20
Passive localisation of mixed far-field and near-field sources using uniform circular arrayBing Xue;Guangyou Fang;Yicai Ji;20162016, vol.52, no.20
Multi-label meta-learning approach for the automatic configuration of classifier ensemblesD.S.C. Nascimento;A.M.P. Canuto;A.L.V. Coelho;20162016, vol.52, no.20
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