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OA期刊


ISSN0013-5194
刊名Electronics letters
出版商Institution of Electrical Engineers
urlhppt://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=2220
机构Wiley



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2019 2020 2021 2022 2023 2024

2019, vol.55, no.1 2019, vol.55, no.10 2019, vol.55, no.11 2019, vol.55, no.12 2019, vol.55, no.14 2019, vol.55, no.15
2019, vol.55, no.16 2019, vol.55, no.17 2019, vol.55, no.18 2019, vol.55, no.19 2019, vol.55, no.2 2019, vol.55, no.20
2019, vol.55, no.21 2019, vol.55, no.22 2019, vol.55, no.23 2019, vol.55, no.24 2019, vol.55, no.25 2019, vol.55, no.3
2019, vol.55, no.4 2019, vol.55, no.5 2019, vol.55, no.6 2019, vol.55, no.7 2019, vol.55, no.8 2019, vol.55, no.9

题名作者出版年年卷期
Towards silicon-photonics based THz linksG. Ducournau;C. Belem;C. Luxey;E. Lacombe;V. Gidel;C. Durand;F. Gianesello;D. Gloria;20192019, vol.55, no.14
Wideband polarisation-insensitive metasurface with tunable near-field scattering focusing characteristicYan-He Lv;Xiao Ding;Bing-Zhong Wang;Ren Wang;20192019, vol.55, no.14
Injection-locked frequency divider with a hybrid 3D multi-path and single-path inductorSheng-Lyang Jang;Chien-Hsing Lu;Jia-Ching Yang;20192019, vol.55, no.14
Comparison of three interval arithmetic-based algorithms for antenna array pattern upper bound estimationGuolong He;Xin Gao;Hui Zhou;Hongquan Zhu;20192019, vol.55, no.14
got to split 20192019, vol.55, no.14



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