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OA期刊


ISSN0013-5194
刊名Electronics letters
出版商Institution of Electrical Engineers
urlhppt://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=2220
机构Wiley



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2019, vol.55, no.1 2019, vol.55, no.10 2019, vol.55, no.11 2019, vol.55, no.12 2019, vol.55, no.14 2019, vol.55, no.15
2019, vol.55, no.16 2019, vol.55, no.17 2019, vol.55, no.18 2019, vol.55, no.19 2019, vol.55, no.2 2019, vol.55, no.20
2019, vol.55, no.21 2019, vol.55, no.22 2019, vol.55, no.23 2019, vol.55, no.24 2019, vol.55, no.25 2019, vol.55, no.3
2019, vol.55, no.4 2019, vol.55, no.5 2019, vol.55, no.6 2019, vol.55, no.7 2019, vol.55, no.8 2019, vol.55, no.9

题名作者出版年年卷期
Chipless frequency selective rasorber with stable performance for oblique incidenceI.G. Lee;W.S. Oh;Y.J. Kim;I.P. Hong;20192019, vol.55, no.21
ResNet-based Trojan detection methodology for protected ICsWeize Yu;Yiming Wen;Xueqing Huang;20192019, vol.55, no.21
RIP-based analysis of multipath matching pursuit in noisy caseJuan Zhao;Xia Bai;Ran Tao;20192019, vol.55, no.21
Optimal search algorithm in a big database using interpolation–extrapolation methodM.N. Kabir;Y.M. Alginahi;J. Ali;E. Abdel-Raheem;20192019, vol.55, no.21
Robust reputation management mechanism in cooperative spectrum sensingJun Wu;Yue Yu;Tiecheng Song;Jing Hu;20192019, vol.55, no.21
Performance analysis for joint processing of pilot and data symbols with channel agingYuanxue Xin;Pengfei Shi;Xuewu Zhang;20192019, vol.55, no.21
Blind symbol packing ratio estimation for faster-than-Nyquist signalling based on deep learningPeiyang Song;Fengkui Gong;Qiang Li;20192019, vol.55, no.21
Dual-channel trench-gate tunnel FET for improved ON-current and subthreshold swingT. Joshi;Y. Singh;B. Singh;20192019, vol.55, no.21
Weakly supervised video action localisation via two-stream action activation networkChang Yin;Zhongke Liao;Haifeng Hu;Dihu Chen;20192019, vol.55, no.21
Hierarchical conformal/non-conformal domain decomposition method for electrostatic and static magnetic field problemsPeng Xie;Li Xu;Jun-hui Yin;Zhong-hai Yang;Bin Li;20192019, vol.55, no.21
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