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OA期刊


ISSN0013-5194
刊名Electronics letters
出版商Institution of Electrical Engineers
urlhppt://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=2220
机构Wiley



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2020, vol.56, no.1 2020, vol.56, no.10 2020, vol.56, no.11 2020, vol.56, no.12 2020, vol.56, no.13 2020, vol.56, no.14
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2020, vol.56, no.9

题名作者出版年年卷期
Super-resolution image reconstruction of compressive 2D near-field millimetre-waveJue Lyu;Dongjie Bi;Xifeng Li;Yongle Xie;Xuan Xie;20202020, vol.56, no.19
Non-destructive detection of coconut quality using RF sensorA. Kumar Varshney;N.P. Pathak;D. Sircar;20202020, vol.56, no.19
Guest Editorial: Non-Destructive TestingRavibabu Mulaveesala;Vanita Arora;Geetika Dua;Vladimir P. Vavilov;Xingwang Guo;Paolo Bison;Nicolas P. Avdelidis;20202020, vol.56, no.19
Estimating magnetic field strength in a porous fin from a surface temperature responseR. Das;B. Kundu;20202020, vol.56, no.19
Robotic scanning technology for laser pulse-echo inspectionS. Lee;J.-M. Hyun;H. Ahmed;J.-R. Lee;20202020, vol.56, no.19
Efficient pulse compression favourable thermal excitation scheme for non-destructive testing using infrared thermography: a numerical studyJ.A. Siddiqui;S. Patil;S.S. Chouhan;S. Wuriti;V. Arora;R. Mulaveesala;20202020, vol.56, no.19
Evaluating impact damage in Kevlar/carbon composites by using laser vibrometry and active infrared thermographyD.A. Derusova;V. P. Vavilov;A.O. Chulkov;B.I. Shagdirov;N. Saeed;M. Omar;20202020, vol.56, no.19
Probability of defect detection in pulse compression favourable thermal excitation schemes for infra-red non-destructive testingV. Kher;R. Mulaveesala;20202020, vol.56, no.19
Investigations on pulse compression favourable thermal imaging approaches for characterisation of glass fibre-reinforce polymersA. Rani;R. Mulaveesala;20202020, vol.56, no.19
Automatic hotspots detection based on UAV infrared images for large-scale PV plantJunfei Nie;Ting Luo;Hui Li;20202020, vol.56, no.19
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