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OA期刊


ISSN0013-5194
刊名Electronics letters
出版商Institution of Electrical Engineers
urlhppt://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=2220
机构Wiley



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2021, vol.57, no.1 2021, vol.57, no.10 2021, vol.57, no.11 2021, vol.57, no.12 2021, vol.57, no.13 2021, vol.57, no.14
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2021, vol.57, no.20 2021, vol.57, no.21 2021, vol.57, no.22 2021, vol.57, no.23 2021, vol.57, no.24 2021, vol.57, no.25
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2021, vol.57, no.9

题名作者出版年年卷期
Regulation of firing rhythms in a four-stable memristor-based Hindmarsh–Rose neuronZhijun Li;Haiyan Zhou;20212021, vol.57, no.19
Intelligent anti-epidemic mask based on KF and ECF fusion algorithmKun Xia;Xiang Li;Xueyong Li;Yiren Liu;Hongwei Zhang;Ruifeng Hou;20212021, vol.57, no.19
Passive wireless respiratory sensorBin Feng;Kai Zhao;Qiucheng Su;Zhentao Yu;Hao Jin;20212021, vol.57, no.19
Serial data transmission at 224 Gbit/s applying directly modulated 850 and 910 nm VCSELsN. Ledentsov Jr;Ł. Chorchos;O. Yu. Makarov;V. A. Shchukin;V. P. Kalosha;J.-R. Kropp;J. P. Turkiewicz;C. Kottke;V. Jungnickel;R. Freund;N. N. Ledentsov;20212021, vol.57, no.19
A novel GaN MIS-HEMT with a floating clamp electrode for suppressing short-channel effectYijun Shi Dr;Hongyue Wang;20212021, vol.57, no.19
Improved charging phenomenon with a modified barrier structure for flexible displays fabricated on polyimide substratesH.J. Kim;J.M. Park;C.W. Byun;S.R. Bak;Y.J. Jung;C.H. Han;J.M. Yoo;S.K. Kim;P.H. Choi;J.H. Lee;J.K. Song;B.D. Choi;20212021, vol.57, no.19
Design of metallic nanocylinder array waveguide for controlling resonant wavelength shiftYuki Ando;Motohiro Endo;Di Wu;Takashi Yamaguchi;Seiya Kishimoto;Shinichiro Ohnuki;20212021, vol.57, no.19
A dual-rate burst-mode receiver with rapid response and high CID tolerance for XGS PONTakanori Kawanaka;Satoshi Yoshima;Masaki Noda;20212021, vol.57, no.19
A wideband bandstop filter with two independently controllable equal-ripple levelsHongyu Chen;Xiaolong Wang;Geyu Lu;20212021, vol.57, no.19
Matching hyperspectral absorptions by weighted hamming distanceBaofeng Guo;20212021, vol.57, no.19
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