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会议文集


会议名2022 Pan Pacific Microelectronics Symposium
中译名《2022年泛太平洋微电子研讨会》
机构Surface Mount Technology Association (SMTA)
会议日期31 January - 3 February 2022
会议地点Honolulu, Hawaii, USA
出版年2022
馆藏号343951


题名作者出版年
LIFE AS AN EPIDEMIOLOGIST TODAY: FROM THE COVID-19 PANDEMIC TO THE TRANSFORMATIVE POTENTIAL OF PRECISION MEDICINEJessica Lasky-Su ScD2022
QUANTUM COMPUTING 101Weishi Wang; Joshuah T. Heath; Jun Yang; Brent Harrison2022
Quantum Computing 2022James D. Whitfield; Jun Yang; Weishi Wang; Joshuah T. Heath; Brent Harrison2022
SCALING ION-TRAP QUANTUM COMPUTERSChristian Ospelkaus; Timko Dubielzig2022
LOW-MELT HIGH-REMELT SOLDER PASTEClaire Hotvedt; Ronald C. Lasky; Sam Lytwynec2022
ADDITIVE MANUFACTURING FOR POWER ELECTRONICS SUBSTRATES: COMPARISON OF PLASMA- AND LASER-BASED METALLIZATION TECHNOLOGIESAlexander Hensel; Thomas Stoll; Jorg Franke; Stefan Stegmeier2022
REJUVENATION OF AGED COMPONENTS: SOLDERABILITYPhil Isaacs; Terry Munson2022
REVIEW ABOUT ADVANCED PACKAGING TECHNOLOGIES FOR OPTO-ELECTRONIC COMPONENTSYanghao Wu; Kai Hollstein; Kirsten Weide-Zaage2022
SRAM TEST CHIP FOR RADIATION EXPERIMENTMoritz Weissbrich; Guillermo Paya-Vaya; Christian Ewert; Kirsten Weide-Zaage; Katharina Schmidt; Dorian Hagenah2022
A NEW X-RAY TUBE TECHNOLOGY TO REVOLUTIONISE ELECTRONICS INSPECTIONKeith Bryant2022
UNDERFILL AND EMC MATERIAL AND INTERFACE PROPERTY EVOLUTION IN UNDERHOOD AUTOMOTIVE TEMPERATURES OVER PERIOD OF 1-YEARPradeep Lall; Yunli Zhang; Madhu Kasturi; Padmanava Choudhury; Haotian Wu2022
HIGHLY ACCELERATED RELIABILITY TEST METHODS FOR EFFICIENT STRESS TESTS WITH EFFECTIVE EQUIVALENCE IN HIGH PERFORMANCE POWER ELECTRONICS PACKAGINGM. Muckelbauer; P. Braeuer; J. Franke2022
DERIVATION OF THE SHEWHART RULESRonald Lasky; Harold Frost; Emily Dean2022
ELECTRONIC HARDWARE EXPOSED TO DISINFECTANTS (DIRECTLY AND INDIRECTLY)Phil Isaacs; Terry Munson2022
ADDITIONAL REASONS FOR CLEANING CIRCUIT ASSEMBLIES (BEYOND ECM PREVENTION)Michael Konrad2022
MINIMIZING VOIDING IN SMT ASSEMBLY OF BTCs: 2022Christopher Nash; Ronald C. Lasky; Emily Belfield; Claire Hotvedt; Kim Flanagan; Thomas Tong2022
EFFECT OF PROCESS RECIPES FOR ADDITIVE PRINTING AND COMPONENT ATTACHMENT ON PERFORMANCE AND RELIABILITYPradeep Lall; Jinesh Narangaparambil; Kartik Goyal; Scott Miller2022
3D HETEROGENEOUSLY INTEGRATED WBG MODULE: OPPORTUNITIES AND CHALLENGESAsif Emon; Yang Li; Sama Salehi Vala; Abdul Basit Mirza; Zhao Yuan; Fang Luo2022
AN ENTREPRENEUR'S JOURNEY DOWN THE RABBIT HOLE WHERE LESS IS MORE, QUIET IS DEAFENING, AND "NO" IS MORE PROFITABLE THAN "YES" - MY JOURNEY AS A RELUCTANT ENTREPRENEURMichael Konrad2022
PREPARING TOMORROW'S PHDS TO BE ENTREPRENEURSAndrew Closson; Emily Dean; Eric Fossum2022
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