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期刊


ISSN0020-2967
刊名Transactions of the Institute of Metal Finishing
参考译名金属精饰学会汇刊
收藏年代1998～2025



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2025, vol.103, no.1 2025, vol.103, no.2 2025, vol.103, no.4

题名作者出版年年卷期
EditorialClive Larson20252025, vol.103, no.4
IMF qualification modulesKaren Yates20252025, vol.103, no.4
Application of closed-loop technology in electroplating production line in ChinaWenjing Chen; Yang Zhang; Miao Yang; Ansheng Li; Jie Ma; Jiantao Qi; An Lin20252025, vol.103, no.4
Sustainable manufacturing in the finishing industries and the management of critical technology metalsChunhong Lei; Sean Scott; Jennifer M. Hartley; Jake M. Yang; Deepa Oberoi; Anthony Lucio; Martin Goosey; Rod Kellner; Andrew P. Abbott; Karl S. Ryder20252025, vol.103, no.4
Investigation of impurity ions on the influence of copper electrodeposition in through holes of printed circuit boardXianming Chen; Wei He; Benxia Huang; Hongbin Cui; Weibin Zhou; Kaijian Cai; Wanjin Wang; Guoqin Chen; Shouxu Wang; Yuanming Chen20252025, vol.103, no.4
Formation and dielectric breakdown behaviour of plasma electrolytic oxidation film formed on AA6061 using pulsed current at various cathodic-to-anodic current density ratiosJuseok Kim; Duyoung Kwon; Heon-Cheol Shin; Sungmo Moon20252025, vol.103, no.4
Mechanism of convection-dependence of leveller and its effect on copper pillar bump filling uniformityLei Feng; Cheng-Bin Dong; Ye Huang; Tao Zhang; Jian-Jun Sun20252025, vol.103, no.4
Antibiofilm potential of graphene-dispersed alkoxysilane coatings: a materials science perspectiveHideyuki Kanematsu; Song-Zhu Shochiku Kure-Chu; Risa Kawai; Hidekazu Miura; Takayoshi Nakano20252025, vol.103, no.4
Influence of functional groups in heterocyclic compounds on microvia filling by copper electrodepositionXiaojing Wang; Xiaonan Zhao; Shenghao Zhao; Zhenyu Wang; Ning Xiao20252025, vol.103, no.4
Low-temperature electroless Ni-P plating on copper-based polyimide substrates for flexible printed circuitsQingang Shi; Jieyao Hu; Hongbin Cui; Weibin Zhou; Kaijian Cai; Wanjin Wang; Liping Jia; Shouxu Wang; Yuanming Chen20252025, vol.103, no.4



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