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期刊
ISSN
0020-2967
刊名
Transactions of the Institute of Metal Finishing
参考译名
金属精饰学会汇刊
收藏年代
1998~2025
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题名
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年卷期
Low-temperature electroless Ni-P plating on copper-based polyimide substrates for flexible printed circuits
Qingang Shi; Jieyao Hu; Hongbin Cui; Weibin Zhou; Kaijian Cai; Wanjin Wang; Liping Jia; Shouxu Wang; Yuanming Chen
2025
2025, vol.103, no.4
Influence of functional groups in heterocyclic compounds on microvia filling by copper electrodeposition
Xiaojing Wang; Xiaonan Zhao; Shenghao Zhao; Zhenyu Wang; Ning Xiao
2025
2025, vol.103, no.4
Antibiofilm potential of graphene-dispersed alkoxysilane coatings: a materials science perspective
Hideyuki Kanematsu; Song-Zhu Shochiku Kure-Chu; Risa Kawai; Hidekazu Miura; Takayoshi Nakano
2025
2025, vol.103, no.4
Mechanism of convection-dependence of leveller and its effect on copper pillar bump filling uniformity
Lei Feng; Cheng-Bin Dong; Ye Huang; Tao Zhang; Jian-Jun Sun
2025
2025, vol.103, no.4
Formation and dielectric breakdown behaviour of plasma electrolytic oxidation film formed on AA6061 using pulsed current at various cathodic-to-anodic current density ratios
Juseok Kim; Duyoung Kwon; Heon-Cheol Shin; Sungmo Moon
2025
2025, vol.103, no.4
Investigation of impurity ions on the influence of copper electrodeposition in through holes of printed circuit board
Xianming Chen; Wei He; Benxia Huang; Hongbin Cui; Weibin Zhou; Kaijian Cai; Wanjin Wang; Guoqin Chen; Shouxu Wang; Yuanming Chen
2025
2025, vol.103, no.4
Sustainable manufacturing in the finishing industries and the management of critical technology metals
Chunhong Lei; Sean Scott; Jennifer M. Hartley; Jake M. Yang; Deepa Oberoi; Anthony Lucio; Martin Goosey; Rod Kellner; Andrew P. Abbott; Karl S. Ryder
2025
2025, vol.103, no.4
Application of closed-loop technology in electroplating production line in China
Wenjing Chen; Yang Zhang; Miao Yang; Ansheng Li; Jie Ma; Jiantao Qi; An Lin
2025
2025, vol.103, no.4
IMF qualification modules
Karen Yates
2025
2025, vol.103, no.4
Editorial
Clive Larson
2025
2025, vol.103, no.4
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