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1999, vol.51, no.1	1999, vol.51, no.10	1999, vol.51, no.11	1999, vol.51, no.12	1999, vol.51, no.2	1999, vol.51, no.3
1999, vol.51, no.4	1999, vol.51, no.5	1999, vol.51, no.6	1999, vol.51, no.7	1999, vol.51, no.8	1999, vol.51, no.9

题名	作者	出版年	年卷期
A metallurgical assessment of SnPbAg solder for GaAs power devices	J. M. Parsey; Jr., S. Valocchi; W. Cronin; J. Mohr; B. L. Scrivner; K. Kyler	1999	1999, vol.51, no.3
Characterizing and monitoring thin-film processes with spectroscopic ellipsometry	Arun R. Srivatsa; Carlos L. Ygartua	1999	1999, vol.51, no.3
Educators lead increases in 1998 U.S. engineering salaries	Tammy M. Beazley	1999	1999, vol.51, no.3
Materials challenges in interconnection: trade-offs for rapid deployment	Kris Frutschy; Zezhong Fu; Deepak Goyal; Ken Kinsman; Gay Samuelson; Ryan Vogt	1999	1999, vol.51, no.3
Materials issues in area-array microelectronic packaging	D. R. Frear	1999	1999, vol.51, no.3
Metallurgical issues in microelectronics	John M. Parsey, Jr.	1999	1999, vol.51, no.3
Metallurgical techniques for more reliable integrated circuits	S. H. Kang; J. W. Morris, Jr.; A. S. Oates	1999	1999, vol.51, no.3
Nondestructive evaluation techniques in semiconductor wafer fabrication	Arun R. Srivatsa	1999	1999, vol.51, no.3
The impact of metals on society part VI: the new world	R. L. Smith	1999	1999, vol.51, no.3
Using CD-SEM metrology in the manufacture of semiconductors	John McIntosh	1999	1999, vol.51, no.3