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期刊
ISSN
0957-4522
刊名
Journal of Materials Science
参考译名
材料科学杂志:电子材料
收藏年代
1999~2013
全部
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2013
2008, vol.19, no.1
2008, vol.19, no.10
2008, vol.19, no.11
2008, vol.19, no.12
2008, vol.19, no.2
2008, vol.19, no.3
2008, vol.19, no.4
2008, vol.19, no.5
2008, vol.19, no.6
2008, vol.19, no.7
2008, vol.19, no.8-9
题名
作者
出版年
年卷期
Structure and photochromism of polyoxometalates nanoparticles in cross-linked polymer networks
Jie Chen; Yan Liu; Wei Feng; Wei-Min Cai
2008
2008, vol.19, no.3
Preparation of CdS{sub}xSe{sub}(1-x) films by brush plating technique and their characteristics
K. R. Murali; P. Elango; P. Andavan; K. Venkatachalam
2008
2008, vol.19, no.3
Phase relations in the Cu{sub}2Te-Al{sub}2Te{sub}3 semiconductor system
B. V. Korzun; A. A. Fadzeyeva; K. Bente; Th. Doering
2008
2008, vol.19, no.3
Effect of temperature on thermally induced defects in silicon
Akbar Ali; Abdul Majid; M. Nawaz Saleh
2008
2008, vol.19, no.3
Effect of inter-electrode spacing on structural and electrical properties of RF sputtered AlN films
J. P. Kar; S. Mukherjee; G. Bose; S. Tuli
2008
2008, vol.19, no.3
The effects of third alloying elements on the bulk Ag{sub}3Sn formation in slowly cooled Sn-3.5Ag lead-free solder
Jun Shen; Shiqiang Lai; Yongchang Liu; Houxiu Gao; Jun Wei
2008
2008, vol.19, no.3
BaTiO{sub}3 and SrBiO{sub}2.5 two phase system NTC thermistors
Xvqiong Li
2008
2008, vol.19, no.3
Effects of bonding frequency on Au wedge wire bondability
Yu Hin Chan; Jang-Kyo Kim; Deming Liu; Peter C. K. Liu; Yiu Ming Cheung; Ming Wai Ng
2008
2008, vol.19, no.3
Effect of Al content on the formation of intermetallic compounds in Sn-Ag-Zn lead-free solder
J. B. Wan; Y. C. Liu; C. Wei; Z. M. Gao; C. S. Ma
2008
2008, vol.19, no.3
Effects of activation time on the electrochemical capacitance of activated carbon nanotubes
Q. Jiang; Q. Zhang; B. Du; R. L. Zou; Y. H. Liu; Y. Zhao
2008
2008, vol.19, no.3
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