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期刊


ISSN0957-4522
刊名Journal of Materials Science
参考译名材料科学杂志:电子材料
收藏年代1999~2013



全部

1999 2000 2001 2002 2003 2004
2005 2006 2007 2008 2009 2010
2011 2012 2013

2008, vol.19, no.1 2008, vol.19, no.10 2008, vol.19, no.11 2008, vol.19, no.12 2008, vol.19, no.2 2008, vol.19, no.3
2008, vol.19, no.4 2008, vol.19, no.5 2008, vol.19, no.6 2008, vol.19, no.7 2008, vol.19, no.8-9

题名作者出版年年卷期
Structure and photochromism of polyoxometalates nanoparticles in cross-linked polymer networksJie Chen; Yan Liu; Wei Feng; Wei-Min Cai20082008, vol.19, no.3
Preparation of CdS{sub}xSe{sub}(1-x) films by brush plating technique and their characteristicsK. R. Murali; P. Elango; P. Andavan; K. Venkatachalam20082008, vol.19, no.3
Phase relations in the Cu{sub}2Te-Al{sub}2Te{sub}3 semiconductor systemB. V. Korzun; A. A. Fadzeyeva; K. Bente; Th. Doering20082008, vol.19, no.3
Effect of temperature on thermally induced defects in siliconAkbar Ali; Abdul Majid; M. Nawaz Saleh20082008, vol.19, no.3
Effect of inter-electrode spacing on structural and electrical properties of RF sputtered AlN filmsJ. P. Kar; S. Mukherjee; G. Bose; S. Tuli20082008, vol.19, no.3
The effects of third alloying elements on the bulk Ag{sub}3Sn formation in slowly cooled Sn-3.5Ag lead-free solderJun Shen; Shiqiang Lai; Yongchang Liu; Houxiu Gao; Jun Wei20082008, vol.19, no.3
BaTiO{sub}3 and SrBiO{sub}2.5 two phase system NTC thermistorsXvqiong Li20082008, vol.19, no.3
Effects of bonding frequency on Au wedge wire bondabilityYu Hin Chan; Jang-Kyo Kim; Deming Liu; Peter C. K. Liu; Yiu Ming Cheung; Ming Wai Ng20082008, vol.19, no.3
Effect of Al content on the formation of intermetallic compounds in Sn-Ag-Zn lead-free solderJ. B. Wan; Y. C. Liu; C. Wei; Z. M. Gao; C. S. Ma20082008, vol.19, no.3
Effects of activation time on the electrochemical capacitance of activated carbon nanotubesQ. Jiang; Q. Zhang; B. Du; R. L. Zou; Y. H. Liu; Y. Zhao20082008, vol.19, no.3
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