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期刊


ISSN0285-5054
刊名松下電工技報
参考译名松下电工技报
收藏年代1998～2003

关联期刊参考译名收藏年代
パナソニック電工技報松下电工技报2009～2011


全部

1998 1999 2000 2001 2002 2003

2000, no.70 2000, no.71 2000, no.72

题名作者出版年年卷期
Analysis of EMI reduction from PWB with cable by metal plateHiroyuki Tominaga20002000, no.71
Analysis of mode conversion of electromagnetic noise injected into electronic equipmentKohji Sasabe; Kazuhisa Yoshida20002000, no.71
Ballistic electron surface-emitting cathode based on porous polysiliconTakashi Hatai; Yoshiaki Honda; Yoshifumi Watabe; Koichi Aizawa; Takuya Komoda; Nobuyoshi Koshida20002000, no.71
Behavior analysis and lifetime prediction of solder bump joints at high temperatureIkko Kuzuhara; Kyoji Tanaka; Shigenari Takami Tomohiro Inoue; Ryoko Toyoda; Atsushi Makino20002000, no.71
Design of flip-chip package using finite element analysisMasahiro Yamamoto; Yoshinobu Momonoi; Ikko Kuzuhara20002000, no.71
Development of build-up multilayer board for flip chip attachmentDaisuke Kanaya; Shuji Maeda; Mitsuji Tagaki; Kazunobu Morioka; Toru Higuchi20002000, no.71
Development of epoxy encapsulation material for BGA/CSPTakashi Toyama; Hiroshi Sugiyama; Takayuki Tsuji; Masashi Nakamura20002000, no.71
Development of tough and strong ceria stabilized tetragonal zirconia nanocomposite and its applicationMasahiro Nawa; Koichi Niihara20002000, no.71
Impedance control technology for multilayer printed wiring boardYasufumi Fukumoto; Tetsuya Okuchi; Yoshihisa Sugawa; Eisaku Saito; Ryoichi Wakashiro; Yukio Hatta20002000, no.71
Influence of glass filler on peeling strength of electroplated circuit on polyamide substrates in MIDNaoto Ikegawa; Kimiaki Nakata; Naoyuki Kondo20002000, no.71
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