【标题】Conformally printed additively manufactured RF demonstrator for circuit compaction
【参考中译】用于电路压缩的保形印刷增材制造RF演示器
【类型】 期刊
【关键词】 Additive manufacturing; Printed electronics; Non-planar circuits; Aerosol jet printing
【参考中译】 增材制造;印刷电子;非平面电路;气溶胶喷射印刷
【作者】 Andrew Luce; Christopher Areias; Susan Trulli; Elicia Harper; Yiwen Zhang; Guinevere Strack; John Lovaasen; Alkim Akyurtlu
【摘要】 Recently, there has been interest in applying additive manufacturing (AM) to radio frequency (RF) and microwave applications, especially in packaging of microelectronic devices. Additive packaging offers advantages of expanded functionality in restricted volume, through miniature, low-SWaP-C sensors, allowing for non-traditional form factors. In this work, design, fabrication, and characterization of a non-planar monolithic microwave integrated circuit (MMIC) is presented to demonstrate significant footprint reduction and circuit compaction. Performance of a non-planar passive RF device and details of planar to non-planar AM connections for characterization of the transitions will be demonstrated. The work will present details of the design and fabrication of the non-planar structure, optimization of the process parameters for the Optomec 5-axis Aerosol Jet Printer for multi-material printing, and the results of the characterization and testing. RF measurements were conducted to demonstrate the functionality of the developed non-planar circuit and compared with simulations which showed good agreement. The results of this work show that fully additive approach is feasible for non-planar circuits, which will allow for footprint reduction, weight reduction, and achievement of novel form factors that are critical for microwave applications.
【参考中译】 最近，人们对将增材制造（AM）应用于射频（RF）和微波应用，特别是在微电子设备的包装中产生了兴趣。增材包装通过微型、低SWaP-C传感器在有限的体积内提供了扩展功能的优势，允许非传统的形状因素。在这项工作中，介绍了非平面单片微波集成电路（MMIC）的设计、制造和特性，以证明显着减少占地面积和电路紧凑性。将演示非平面无源RF器件的性能以及用于描述转变的平面到非平面AM连接的详细信息。该工作将详细介绍非平面结构的设计和制造、用于多材料打印的Optomec 5轴气溶胶喷射打印机的工艺参数优化以及特性描述和测试结果。进行了RF测量以证明所开发的非平面电路的功能，并与模拟进行了比较，结果显示出良好的一致性。这项工作的结果表明，完全添加方法对于非平面电路是可行的，这将有助于减少占地面积、减轻重量并实现对微波应用至关重要的新型形状因素。
【来源】 Flexible and Printed Electronics 2024, vol.9, no.4
【入库时间】 2025/4/2
【标题】Adopting additive manufacturing
【参考中译】采用增材制造
【作者】 Linde Gases
【摘要】 As much a mindset change as it is technological. Companies putting manufacturing at the heart of their business are under mounting pressure, both from global competition and the rapid rise in technological advancements that are changing the way goods are manufactured. With mass production having largely shifted to developing economies, Western companies are moving towards lower volume production of high-added value, innovative, customizable and more sustainable products. They also continue to seek out ways to improve cycle times, reduce waste and maximize work flow.
【参考中译】 思维方式的改变和技术的改变一样大。将制造业置于业务核心的公司面临着越来越大的压力，既来自全球竞争，也来自改变商品制造方式的技术进步的快速发展。随着大规模生产基本转移到发展中经济体，西方公司正在转向低批量生产高附加值、创新、可定制和更可持续的产品。他们还继续寻找改善周期时间、减少浪费和最大化工作流程的方法。
【来源】 Gasworld 2020, vol.58, no.1
【标题】TEMPERATURE CONTROL - HELPING ADDRESS THE HOTTEST TOPIC IN ADDITIVE MANUFACTURING
【参考中译】温度控制-帮助解决添加收件箱中最热门的主题
【作者】 anonymous
【摘要】 Nigel Bedford, technical development manager at Donaldson BOFA, explains why temperature control and emissions extraction are essential for success and safety during additive manufacturing. Innovations in additive manufacturing (AM) and materials science are enabling an 'anything and everything on demand' revolution in 3D printing. Traditional manufacturing processes are increasingly being replaced by AM systems and, even where a traditional approach provides a more cost-effective option, 3D printers are often an enabler for those solutions - by printing tooling, for example.
【参考中译】 Donaldson BOFA技术开发经理Nigel Bedford解释了为什么温度控制和排放物提取对于增材制造的成功和安全至关重要。增材制造（AM）和材料科学的创新正在推动3D打印领域“按需进行任何事情”的革命。传统的制造流程越来越多地被AM系统取代，即使传统方法提供了更具成本效益的选择，3D打印机也常常成为这些解决方案的推动者--例如，通过打印工具。
【来源】 Design Solutions 2024, no.Nov.