先进制造业知识服务平台
国家科技图书文献中心机械分馆　　工信部产业技术基础公共服务平台　　国家中小企业公共服务示范平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

1999, vol.121, no.1 1999, vol.121, no.2 1999, vol.121, no.3 1999, vol.121, no.4

题名作者出版年年卷期
A damage coupling framework of unified viscoplasticity for the fatigue of solder alloysZ. Qian; W. Ren; S. Liu19991999, vol.121, no.3
A heat sink performance study considering material, geometry, nozzle placement, and Reynolds number with air impingementJ. G. Maveety; J. F. Hendricks19991999, vol.121, no.3
Analysis of solder paste release in fine pitch stencil printing processesG. Rodriguez; D. F. Baldwin19991999, vol.121, no.3
Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloyX. Q. Shi; W. Zhou; H. L. J. Pang; Z. P. Wang19991999, vol.121, no.3
Hygrothermal fracture analysis of plastic IC package in reflow soldering processKang Yong Lee; Taek Sung Lee19991999, vol.121, no.3
Interior stress for axisymmetric abrasive indentation in the free abrasive machining process: slicing silicon wafers with modern wiresawF. Yang; I. Kao19991999, vol.121, no.3
J-lead solder joint thermal fatigue life modelT. E. Wong; L. A. Kachatorian; H. M. Cohen19991999, vol.121, no.3
Minimization of heat sink mass using CFD and mathematical optimizationK. J. Craig; D. J. de Kock; P. Gauche19991999, vol.121, no.3
Numerical and experimental prediction of transitional characteristics of flow and heat transfer in an array of heated blocksY. Asako; Y. Yamaguchi; M. Faghri19991999, vol.121, no.3
Three-dimensional versus two-dimensional finite element modeling of flip-chip packagesQ. Yao; J. Qu19991999, vol.121, no.3
12



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024