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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2016, vol.138, no.1 2016, vol.138, no.2 2016, vol.138, no.3 2016, vol.138, no.4

题名作者出版年年卷期
Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink TemperaturePearson, Matthew R.; Lents, Charles E.20162016, vol.138, no.4
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip StacksBrunschwiler, Thomas; Zurcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Burg, Brian; Zimmermann, Severin; Zschenderlein, Uwe; Wunderle, Bernhard; Schindler-Saefkow, Florian; Stassle, Rahel20162016, vol.138, no.4
A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat ConductionChen, Cheng; Geer, James; Sammakia, Bahgat20162016, vol.138, no.4
Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics ModuleGess, Joshua; Bhavnani, Sushil; Johnson, R. Wayne20162016, vol.138, no.4
Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid-Solid Reaction CouplesHsu, Shou-Jen; Lee, Chin C.20162016, vol.138, no.4
Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal AgingZhu, Yan; Sun, Fenglian20162016, vol.138, no.4
Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric MaterialsFeng, Dudong; Yao, Shi-Chune; Zhang, Tian; Zhang, Qiming20162016, vol.138, no.4
Modular Microfluidic Filters Based on Transparent MembranesArchibong, E.; Tuazon, H.; Wang, H.; Winskas, J.; Pyayt, A. L.20162016, vol.138, no.4
Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock ResponseKallolimath, Sharan; Zhou, Jiang Jenny20162016, vol.138, no.4
Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental ConditionsMahan, Kenny; Rosen, David; Han, Bongtae20162016, vol.138, no.4
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