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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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1998, vol.120, no.2 1998, vol.120, no.3 1998, vol.120, no.4

题名作者出版年年卷期
The effect of underfill and underfill delamination on the thermal stress in flip-chip solder jointsS. Rzepka; M. A. Korhonen; E. Meusel; C. -Y. Li19981998, vol.120, no.4
Reliability of underfill-encapsulated flip-chips with heat spreadersH. Doi; K. Kawano; A. Yasukawa; T. Sato19981998, vol.120, no.4
Potential failure sites in a flip-chip package with and without underfillE. Madenci; S. Shkarayev; R. Mahajan19981998, vol.120, no.4
Measurement of interfacial fracture toughness under combined mechanical and thermal stressesJ. Jiao; C. K. Gurumurthy; E. J. Kramer; Y. Sha; C. Y. Hui; P. Borgesen19981998, vol.120, no.4
Experimental study on electric-current induced damage evolution at the crack tip in thin film conductorsA. -F. Bastawros; K. -S. Kim19981998, vol.120, no.4
Direct measurement of the adhesive fracture resistance of CVD diamond particlesS. Kamiya; H. Takahashi; M. Saka; H. Abe19981998, vol.120, no.4
Cooling rate effect on post cure stresses in molded plastic IC packagesS. Yi; K. Y. Sze19981998, vol.120, no.4
Adhesion and reliability of polymer/inorganic interfacesS. -Y. Kook; J. M. Snodgrass; A. Kirtikar; R. H. Dauskardt19981998, vol.120, no.4
A thermo-mechanical approach for fatigue testing of polymer bimaterial interfacesC. K. Gurumurthy; J. Jiao; L. G. Norris; G. -Y. Hui; E. J. Kramer19981998, vol.120, no.4
A thermodynamic framework for damage mechanics of solder jointsC. Basaran; C. -Y. Yan19981998, vol.120, no.4
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