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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2004, vol.126, no.1 2004, vol.126, no.2 2004, vol.126, no.3 2004, vol.126, no.4

题名作者出版年年卷期
A Hybrid Thermal Energy Storage Device, Part 1: Design MethodologyNing Zheng; R. A. Wirtz20042004, vol.126, no.1
A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of MeritNing Zheng; R. A. Wirtz20042004, vol.126, no.1
Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit BoardRandy D. Weinstein; Amy S. Fleischer; Kimberly A. Krug20042004, vol.126, no.1
Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch DevicesLi Ming Yu; Bang Han Sur; Kim Young Pyo; Wang Chun Qing; Zhang Lei20042004, vol.126, no.1
Engineering of Superconductive CeramicsAnatoly E. Rokhvarger; Lubov A. Chigirinsky20042004, vol.126, no.1
The Moulded Electronic Package (MEP)David J. J. Lowrie20042004, vol.126, no.1
Why Gold Flash Can Be Detrimental to Long-Term ReliabilityJingsong Xie; Ming Sun; Michael Pecht; David F. Barbe20042004, vol.126, no.1
Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling ConditionSeungmin Cho; Bongtae Han; Jinwon Joo20042004, vol.126, no.1
Investigation of Flip-Chip Bonding for MEMS ApplicationsW. Salalha; E. Zussman; P. Z. Bar-Yoseph20042004, vol.126, no.1
Optimum Gullwing Fillet Solder Joint Under Thermomechanical ForcesL. L. Meekisho; K. Nelson-Owusu20042004, vol.126, no.1
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