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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2017, vol.139, no.1 2017, vol.139, no.2 2017, vol.139, no.3 2017, vol.139, no.4

题名作者出版年年卷期
Flexible Thermal Ground Planes Fabricated With Printed Circuit Board TechnologyLiew, Li-Anne; Lin, Ching-Yi; Lewis, Ryan; Song, Susan; Li, Qian; Yang, Ronggui; Lee, Y. C.20172017, vol.139, no.1
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks (vol 138,pr 041009,2016)Urcher, Jonas Z.; Del Carro, Luca; Schlottig, Gerd; Burg, Brian; Zimmermann, Severin; Brunschwiler, Thomas; Zschenderlein, Uwe; Wunderle, Bernhard; Schindler-Saefkow, Florian; Strassle, Rahel20172017, vol.139, no.1
Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic CoolingAgarwal, Gunjan; Kazior, Thomas; Kenny, Thomas; Weinstein, Dana20172017, vol.139, no.1
Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A ReviewHan, Bongtae; Kim, Dae-Suk20172017, vol.139, no.1
Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-toWafer BondingOprins, Herman; Cherman, Vladimir; Webers, Tomas; Salahouelhadj, Abdellah; Kim, Soon-Wook; Peng, Lan; Van der Plas, Geert; Beyne, Eric20172017, vol.139, no.1
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall MicrogapsNasr, Mohamed H.; Green, Craig E.; Kottke, Peter A.; Zhang, Xuchen; Sarvey, Thomas E.; Joshi, Yogendra K.; Bakir, Muhannad S.; Fedorov, Andrei G.20172017, vol.139, no.1
Measurement of Air Flow Rate Through Perforated Floor Tiles in a Raised Floor Data CenterArghode, Vaibhav K.; Kang, Taegyu; Joshi, Yogendra; Phelps, Wally; Michaels, Murray20172017, vol.139, no.1
Electroplated Connections Between Carbon Fiber and NickelBilger, Christopher; Bruck, Hugh A.; Dasgupta, Abhijit20172017, vol.139, no.1
Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal ManagementNakayama, Wataru20172017, vol.139, no.1
Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface MaterialsGao, Yunxia; Wang, Xianping; Liu, Jing; Fang, Qianfeng20172017, vol.139, no.1
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