先进制造业知识服务平台
国家科技图书文献中心机械分馆  工信部产业技术基础公共服务平台  国家中小企业公共服务示范平台

期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志;美国机械工程师学会汇刊
收藏年代1995~2023



全部

1995 1996 1997 1998 1999 2000
2001 2002 2003 2004 2005 2006
2007 2008 2009 2010 2011 2012
2013 2014 2015 2016 2017 2018
2019 2020 2021 2022 2023

2017, vol.139, no.1 2017, vol.139, no.2 2017, vol.139, no.3 2017, vol.139, no.4

题名作者出版年年卷期
The Effects of Silica Fillers on the Properties of Encapsulation Molding CompoundsLiaw, Yowching; Chou, Jung-Hua20172017, vol.139, no.3
Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin EvaporatorFalsetti, C.; Magnini, M.; Thome, J. R.20172017, vol.139, no.3
Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic AssembliesIyer, Rajiv L.; Santos, Daryl L.20172017, vol.139, no.3
Overview of Human Thermal Responses to Warm Surfaces of Electronic DevicesHedge, Alan; Zhang, Han20172017, vol.139, no.3
A Review on Laser Processing in Electronic and MEMS PackagingRahim, Kaysar; Mian, Ahsan20172017, vol.139, no.3
Influence of Secondary Impact on Printed Wiring Assemblies-Part II: Competing Failure Modes in Surface Mount ComponentsMeng, Jingshi; Dasgupta, Abhijit20172017, vol.139, no.3
Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder AlloysThambi, Joel; Schiessl, Andreas; Waltz, Manuela; Lang, Klaus-Dieter; Tetzlaff, Ulrich20172017, vol.139, no.3
Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting DiodesLaw, Thong Kok; Lim, Fannon; Li, Yun; Puan, XuePeng; Sng, G. K. E.; Teo, J. W. Ronnie20172017, vol.139, no.3
Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch AssembliesWassick, Thomas; Cournoyer, Maryse; Tunga, Krishna20172017, vol.139, no.3
Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Coolingde Oliveira, Pablo A.; Barbosa, Jader R., Jr.20172017, vol.139, no.3
12