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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2023



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2018, vol.140, no.1 2018, vol.140, no.2 2018, vol.140, no.3 2018, vol.140, no.4

题名作者出版年年卷期
Gold-Tin Solder Wetting Behavior for Package Lid SealsVianco, Paul T.; Kilgo, Alice C.; McKenzie, Bonnie M.20182018, vol.140, no.2
Special Section on InterPACK 2017-Part 2Mysore, Kaushik; Narumanchi, Sreekant; Dede, Ercan; Khiabani, Reza20182018, vol.140, no.2
Challenges in Three-Dimensional Printing of High-Conductivity CopperEl-Wardany, Tahany I.; She, Ying; Jagdale, Vijay N.; Garofano, Jacquelynn K.; Liou, Joe J.; Schmidt, Wayde R.20182018, vol.140, no.2
Peel-and-Stick Sensors Powered by Directed Radio-Frequency EnergySchwartz, David Eric; Smith, Clinton J.; Lee, Joseph; Gowri, Shakthi Priya; Daniel, George; Lalau-Keraly, Christopher; Baudenon, Quentin; Saavedra, J. R. M.20182018, vol.140, no.2
Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical SimulationGreve, Hannes; Moeini, S. Ali; McCluskey, Patrick; Joshi, Shailesh20182018, vol.140, no.2
Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network ModelVaitheeswaran, Pavan Kumar; Subbarayan, Ganesh20182018, vol.140, no.2
Enhanced Heat Transfer Using Microporous Copper Inverse OpalsLee, Hyoungsoon; Maitra, Tanmoy; Palko, James; Kong, Daeyoung; Zhang, Chi; Barako, Michael T.; Won, Yoonjin; Asheghi, Mehdi; Goodson, Kenneth E.20182018, vol.140, no.2
Failure Analysis of Direct Liquid Cooling System in Data CentersAlkharabsheh, Sami; Puvvadi, Udaya L. N.; Ramakrishnan, Bharath; Ghose, Kanad; Sammakia, Bahgat20182018, vol.140, no.2
Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134aCataldo, Filippo; Thome, John Richard20182018, vol.140, no.2
Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification PerspectiveMeyyappan, Karumbu; Vujosevic, Milena; Wu, Qifeng; Malatkar, Pramod; Hill, Charles; Parrott, Ryan20182018, vol.140, no.2
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