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期刊


ISSN1043-7398
刊名Journal of Electronic Packaging
参考译名电子封装杂志；美国机械工程师学会汇刊
收藏年代1995～2024



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2024, vol.146, no.2 2024, vol.146, no.3

题名作者出版年年卷期
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic PackagingChen, Yuan; Wang, Zhongyang; Fan, Yuhui; Dong, Ming; Liu, Dengxue20242024, vol.146, no.3
Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder MaterialsStang, E.; Lesko, C.; Young, D.20242024, vol.146, no.3
Characterization of a Rack-Level Thermosyphon-Based Cooling SystemKhalid, R.; Schon, S. G.; Amalfi, R. L.; Ortega, A.; Wemhoff, A. P.20242024, vol.146, no.3
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic PackagingShih, Meng-Kai; Lin, Guan-Sian; Yang, Jonny20242024, vol.146, no.3
Hybrid Bonding for Ultra-High-Density InterconnectLu, Mei-Chien20242024, vol.146, no.3
Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural NetworkZhang, Liwen; Yang, Chen; Yang, He; Wang, Jinchan; Zhang, Jincan20242024, vol.146, no.3
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain GaugesWang, Y. W.; Tsai, M. Y.; Chou, Y. S.20242024, vol.146, no.3
Forward Kinematics Analysis of High-Precision Optoelectronic Packaging PlatformWang, Ziyang; Zhou, Haibo; Xiao, Linjiao; Duan, Lian20242024, vol.146, no.3
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal AgingLall, Pradeep; Mehta, Vishal; Suhling, Jeff; Blecker, Ken20242024, vol.146, no.3
Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature ExposureLall, Pradeep; Pandurangan, Aathi Raja Ram; Blecker, Ken20242024, vol.146, no.3
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