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期刊


ISSN1057-7157
刊名Journal of Microelectromechanical Systems
参考译名微机电系统杂志
收藏年代1998～2013



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2006, vol.15, no.1 2006, vol.15, no.2 2006, vol.15, no.3 2006, vol.15, no.4 2006, vol.15, no.5 2006, vol.15, no.6

题名作者出版年年卷期
Programmable Reconfigurable Self-Assembly: Parallel Heterogeneous Integration of Chip-Scale Components on Planar and Nonplanar SurfacesJaehoon Chung; Wei Zheng; Thomas J. Hatch; Heiko O. Jacobs20062006, vol.15, no.3
Piezoelectric Al{sub}0.3Ga{sub}0.7As Longitudinal Mode Bar ResonatorsLihua Li; Parshant Kumar; Lynn Calhoun; Don L. DeVoe20062006, vol.15, no.3
Quality Factor in Trench-Refilled Polysilicon Beam ResonatorsReza Abdolvand; Houri Johari; Gavin K. Ho; Ahmet Erbil; Farrokh Ayazi20062006, vol.15, no.3
Error Sources in In-Plane Silicon Tuning-Fork MEMS GyroscopesMarc S. Weinberg; Anthony Kourepenis20062006, vol.15, no.3
A Micromachined Reaction Force Actuator (RFA) for a Nanomanipulator PreparationIl-Han Hwang; Eui-Sung Yoon; Jong-Hyun Lee20062006, vol.15, no.3
Lifetime Studies of Electrothermal Bent-Beam Actuators in Single-Crystal Silicon and PolysiliconLarry L. Chu; Long Que; Andrew D. Oliver; Yogesh B. Gianchandani20062006, vol.15, no.3
Encapsulated Submillimeter Piezoresistive AccelerometersWoo-Tae Park; Aaron Partridge; Rob N. Candler; Vipin Ayanoor-Vitikkate; Gary Yama; Markus Lutz; Thomas W. Kenny20062006, vol.15, no.3
Device-Level Hermetic Packaging of Microresonators by RTP Aluminum-to-Nitride BondingMu Chiao; Liwei Lin20062006, vol.15, no.3
Sea-of-Leads MEMS I/O Interconnects for Low-k IC PackagingBing Dang; Muhannad S. Bakir; Chirag S. Patel; Hiren D. Thacker; James D. Meindl20062006, vol.15, no.3
Wafer-Level Packaging Based on Uniquely Orienting Serf-Assembly (The DUO-SPASS Processes)Jiandong Fang; Karl F. Bohringer20062006, vol.15, no.3
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