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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2013, vol.13, no.1 2013, vol.13, no.10 2013, vol.13, no.2 2013, vol.13, no.3 2013, vol.13, no.4 2013, vol.13, no.5
2013, vol.13, no.6 2013, vol.13, no.7 2013, vol.13, no.8 2013, vol.13, no.9

题名作者出版年年卷期
Derating is NOT always the answerCraig Hillman20132013, vol.13, no.9
Mixed results but some signs of better times aheadWalt Custer; Jon Custer-Topai20132013, vol.13, no.9
Placement quality - a key performance indicator for profitabilityRichard Wilders20132013, vol.13, no.9
The future of PCB manufactureJohn Cunningham20132013, vol.13, no.9
Is soldering truly necessary for electronic assembly?Joe Fjelstad20132013, vol.13, no.8
Off shoring, on shoring - not suring?Keith Bryant20132013, vol.13, no.8
You cannot pass or fail HALTCraig Hillman20132013, vol.13, no.8
Tips for outsourcing to the Asia-Pacific regionJack Daniels20132013, vol.13, no.8
The elegance of Line Scan Technology for AOIMike Riddle20132013, vol.13, no.8
3D printing in the electronics industryArjen Koppens20132013, vol.13, no.7
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