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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2008, vol.8, no.1 2008, vol.8, no.10 2008, vol.8, no.11 2008, vol.8, no.12 2008, vol.8, no.2 2008, vol.8, no.3
2008, vol.8, no.4 2008, vol.8, no.5 2008, vol.8, no.6 2008, vol.8, no.7 2008, vol.8, no.8 2008, vol.8, no.9

题名作者出版年年卷期
Vapour phase or convection for lead-free?Bob Willis20082008, vol.8, no.12
Molded underfill process for the SiPTae Hyun Kim; Ki Chan Kim; Sung Yi; Dong-Kuk Kim; Tae Sung Jung; Jin Su Kim; Joseph Y. Lee20082008, vol.8, no.12
Thermally conductive liquid materials for electronics packagingSanjay Misra20082008, vol.8, no.12
Reflow significance on package on package (PoP) assemblyS. Manian Ramkumar; Brian O'Leary20082008, vol.8, no.12
Downturn through 2009 (being blunt)Walt Custer; Jon Custer-Topai20082008, vol.8, no.12
Creep-fatigue model for SAC405/305 solder joint reliability estimation - a proposalWerner Engelmaier20082008, vol.8, no.12



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