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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2012, vol.12, no.1 2012, vol.12, no.10 2012, vol.12, no.11 2012, vol.12, no.12 2012, vol.12, no.2 2012, vol.12, no.3
2012, vol.12, no.4 2012, vol.12, no.5 2012, vol.12, no.6 2012, vol.12, no.7 2012, vol.12, no.8 2012, vol.12, no.9

题名作者出版年年卷期
The solution to one of SMT's stickier problemsMichael Zahn20122012, vol.12, no.7
Drop test performance of BGA assembly using SAC105H solder sphereWeiping Liu; Ning-Cheng Lee; Simin Bagheri; Polina Snugovesky; Jason Bragg; Russell Brush; Blake Harper20122012, vol.12, no.7
Small matters: Rethinking electronic component design approach and the benefit that lies withinJoe Fjelstad20122012, vol.12, no.7
Reduction of voids in solder joints - an alternative to vacuum solderingRolf Diehm; Mathias Nowottnick; Uwe Pape20122012, vol.12, no.7
Why perform failure analysis?Craig Hillman20122012, vol.12, no.7
Out on safari at ECTCSandra Winkler20122012, vol.12, no.7



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