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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
Defect Troubleshooter: As good as the information providedBob Willis20072007, vol.7, no.11
SnAgCuBi and SnAgCuBiSb solder joint properties investigationsR. Kisiel; K. Bukat; J. Sitek; W. Gasior; Z. Moser; J. Pstrus20072007, vol.7, no.11
Technology Focus: in the electronics industryTrevor Galbraith20072007, vol.7, no.11
Embedded thermoelectric coolingJesko von Windheim20072007, vol.7, no.11
Recovering at a slower pace: Holiday electronics' purchases are keyJon Custer-Topai; Walt Custer20072007, vol.7, no.11
Reducing power consumption by selecting optimal oven recipesAbhinav Ajmera20072007, vol.7, no.11
Film vs. paste: Die attach options for stacked die applicationsJames T. Huneke; Robert Chu; Jin-O Choi; Howard Yun; Han Wu20072007, vol.7, no.11
How to assure solder accelerated testingWerner Engelmaier20072007, vol.7, no.11
Company focus - Sovtest ATETrevor Galbraith20072007, vol.7, no.11



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