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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2011, vol.11, no.1 2011, vol.11, no.10 2011, vol.11, no.11 2011, vol.11, no.2 2011, vol.11, no.3 2011, vol.11, no.4
2011, vol.11, no.5 2011, vol.11, no.6 2011, vol.11, no.7 2011, vol.11, no.8 2011, vol.11, no.9

题名作者出版年年卷期
Let's get small(er) - Reducing electronic product sizeJoe Fjelstad20112011, vol.11, no.2
5D solder paste inspection - merits beyond 3D technologyHenk Biemans20112011, vol.11, no.2
Process validation and standards complianceBjarne Moller; Henry Jurgens20112011, vol.11, no.2
Solder joint embrittlement - it's not just goldWerner Engelmaier20112011, vol.11, no.2
Factors influencing QFN processParminder Singh20112011, vol.11, no.2
Case Study - When sacrificing PCBs for the initial production run is not an optionTrevor Galbraith20112011, vol.11, no.2
A look ahead - Special guest columnGene Weiner20112011, vol.11, no.2



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