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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2023

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023

2011, vol.11, no.1 2011, vol.11, no.10 2011, vol.11, no.11 2011, vol.11, no.2 2011, vol.11, no.3 2011, vol.11, no.4
2011, vol.11, no.5 2011, vol.11, no.6 2011, vol.11, no.7 2011, vol.11, no.8 2011, vol.11, no.9

题名作者出版年年卷期
Global disasters: Impact on world electronics production?Walt Custer; Jon Custer-Topai20112011, vol.11, no.4
Integrating cleaning agent and cleaning equipment for maximum performanceSerge Tuerlings20112011, vol.11, no.4
The miniature component solder paste printing processMitch Holtzer; Tom Hunsinger; Joe Belmonte20112011, vol.11, no.4
Optimizing process performanceJay Gorajia20112011, vol.11, no.4
Solder joint accelerated test reliability requirements - a bad example: Specifying solder joint reliability requirements requires understanding of solder creep-fatigue behaviorWerner Engelmaier20112011, vol.11, no.4
Thermal management, part 1: A hot topic, and its getting hotter...Joe Fjelstad20112011, vol.11, no.4
Contract electronic manufacturers with staying power: How three small-to-medium-sized companies have achieved lasting success in this tough, dynamic industryPamela J. Gordon20112011, vol.11, no.4
Solder paste residue corrosivity assessment: Bono testCeline Puechagut; Anne-Marie Laugt; Emmanuelie Guene; Richard Anisko20112011, vol.11, no.4
New web-based system gives manufacturers full view of their production runsTrevor Galbraith20112011, vol.11, no.4
SMART Group becomes a Ship InspectorBob Willis20112011, vol.11, no.4
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